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November 1997

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Subject:
Underfill voiding in flip chips
From:
Nitin Juneja <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 17 Nov 1997 16:52:14 EST
Content-Type:
text/plain
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*** Resending note of 11/17/97 16:48
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
From: Nitin Juneja
Subject: Underfill voiding in flip chips
---------------------------------------------------------------
Hi,

Does anyone know of specs regarding acceptable voiding in underfills
for flip chips

Nitin

---------------------------------------------------------------
Nitin Juneja                                   (P)(416)448-6301
Process Engineering and Development            (F)(416)448-4810
Celestica Inc, Toronto                      [log in to unmask]

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