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Reply To: | TechNet Mail Forum. |
Date: | Mon, 17 Nov 1997 16:42:50 -0500 |
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Ronan,
Work by Motorola, presented by Andrew Mawer, points in the direction of
voids not necessarily being a bad thing. One of the committees of the
IPC is trying to formulate a spec for an upper limit on the amount of
voids. Consensus (early days yet) seems to be centering around the 20%
range.
Bev Christian
Nortel
>----------
>From: [log in to unmask][SMTP:[log in to unmask]]
>Sent: Tuesday, November 11, 1997 4:56 PM
>To: [log in to unmask]
>Subject: [TN] Voids in Eutectic BGA joints
>
>Can anyone shed some light on the effect of voids of various diameters in
>eutectic BGA joints? I have heard claims that they can suppress crack
>propagation in joints under cyclic conditions. Is this true, or are voids
>more undesirable than desirable?
>
>Any comments would be much appreciated.
>
>Ronan Kennedy
>Manufacturing Engineer
>3Com Ireland
>
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