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Reply To: | TechNet Mail Forum. |
Date: | Mon, 17 Nov 1997 14:28:37 -0500 |
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Ken,
The answer depends upon your process, throughput and what you are
soldering.
At one employer I had one line where I needed to purge copper every
couple months due to bare copper panels, the next line over, at
similar solder consumption and equipment required purging every other
year.
At another employer, dross production was so high we had to add tin
monthly to maintain composition until we could fix the problem.
I suggest that you start at once/month until you notice you have
composition changes. If you have no changes, try every two months,
then once/quarter. Don't go less frequently, as unmonitored factors
may affect your composition.
Just my experience,
Aric Parr
______________________________ Reply Separator _________________________________
Subject: [TN] frequency of solder pot content analysis
Author: Ken Patel <[log in to unmask]> at INTERNET
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