TECHNET Archives

November 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
FW: [TN] frequency of solder pot content analysis -Reply
From:
Ron Hayashi <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 17 Nov 1997 11:27:38 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
A lot would depend on the volume of parts run through the wave as well
as the size of the reservoir. How often do you add solder, how often do
you decant solder from the resevoir? Just a few things to consider as
you decide how often to do an analysis of the solder.
You can also check with your solder supplier for additional information
regarding this.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2