Joe..
        Sounds like fun.. We have keep away from J-lead since foreever
  and still fight it if the electrical community starts to push them.
  We have been successful over many battles.
       Our designs are multilayer with SMT and most microcircuits are
  of the gull-wing configuration, dips thrown in now and then. That said,
  this is one way that you might rework a device. Unsolder the lead and
  lift just enough to insert a 2-3 mil thick piece of insulation material
  between the lead and the pad/footprint on the board. Size insulator to
  be slighly larger than the footprint and bound in place. After curing,
  if necessary, solder jumper to J-Lead. To access internal circuity, this
  could be a nightmare based on your design, wire to via associated with
  isolated finger. Since we are designing multilayers, every finger has a
  stringer to its associated via and that makes life possible. Never said
  this was easy and for J-leads, maybe a little harder. Hope this helps or
  at least, gets others to respond. When you work out a fix, would you
  share your findings? Thanks in advance and good luck.

                                                 Regards,
Norden Systems                                           Bob Vanech
Norwalk, Ct.

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