Douglas, I may not be the most qualified on this subject but, many customers
have found OA processing (water soluble fluxes/pastes) more successful due to
the improved activity under the component. With OA, nitrogen or inert gas
soldering is less critical.

If no-clean is in use, nitrogen becomes much more relevant but the flux
activity is generally insufficient to guarantee good soldering under BGA's.

Clean v No-clean? Is this why you have a shy audience?

Graham Naisbitt


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-----Original Message-----
From:   TechNet  On Behalf Of Douglas H. Bennett
Sent:   Monday, November 03, 1997 4:40 PM
To:     [log in to unmask]
Subject:        [TN] Responses Needed Please!!Nitrogen use w/ BGA reflow

I sent this message last week and am still waitng on some responses.  Can
anyone help please???


Hello All,

I am working with some guys just getting into BGA work.  We have some
questions about the need for Nitrogen in the reflow process.  Does anyone
have any good examples/data/stories etc about how nitrogen has helped with
a BGA application.  In other words we are looking for good reasons to
invest in nitrogen to use on the BGA's.

Thanks in advance....

DHB

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