There are about 5 different methods currently being used to coat LPI solder
masks. These include:

   A. Horizontal screening (manual or semi automatic) with either single side
processing or double side processing using the "standoff" pins or "dimple
plate".
   B. Vertical, double sided screening, such as the DP-10 type machines (or
Ichinose or Cugher).
   C. Curtain coating (Ciba, Mass, Vibrosystems, etc)
   D. Electrostatic spraying (Grace, Lea Ronal, etc)
   E. Non electrostatic spraying (Gyres, Argus, Halco, etc.)

I have run a number of different types of LPI solder masks on all of the
above mentioned application systems and believe that all have advanatages and
disadvantages. I also have my opinions about the application systems that I'd
be happy to share with you (but not on the Technet).

If you'd like to LPI application systems further, please contact me at:

   A. Phone - (765)-628-7401
   B. Fax - (765)-628-7401
   C. e-mail - [log in to unmask]

Regards,

Larry Fisher
Dexter Electronic Materials

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