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November 1997

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Subject:
From:
Michael Jeremias <[log in to unmask]>
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Date:
Thu, 13 Nov 1997 14:14:03 -0800
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Dear BGA-Fans!
 
 A Compendium of reliability Data is found in the course of  John H.Lau,
 from Express Packaging Systems, USA held  at the PEP'97 in
 NORRKÖPING, Sweden.
 It helps to find some influences on the reliability of the different
 elements of a BGA-Assembly but it doesn't replace and is not equal to
 Your own application specific tests because the number of parameters is
 so high.

        

 Other results  You can find in the proceedings of the Workshop
6/11/1997 in Stuttgart,Germany
 "Mikrotechnische Produktion, Zuverlässigkeit an
Bauelementen,Leiterplatten und  Baugruppen" .

I, myself  am looking for BGA-Applications for Avionics, where the
problem is the high and 
low-temperatur range, the reliability and experiences with ceramic BGA's
. 

Who can help me with literature and papers and experiences.

Contact Mr. Liese 
e-mail:      [log in to unmask]

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