D. Terstegge wrote:
> 
> Hello Technet,
> 
> Instead of testing reliability of producs with PBGA's by thermal cycling
> and shock & vibration tests, I prefer to rely on publicly available
> test-data. Does anyone know a source for such test data or related
> information ?
> 
> Daan Terstegge
>  Dear BGA-Fans!

A Compendium of reliability Data is found in course of  John H.Lau,
Express from Express Packaging Systems, USA held  at the PEP'97 in
NORRKÖPING, Sweden. 
It helps to find some influences on the reliability of the different
elements of a BGA-Assembly but it doesn't replace and is not equal to
Your own application specific tests because the number of parameters is
so high.
Other results  You can find in the proceedings of the Workshop 6/11/1997
Mikrotechnische Produktion at Mr. Liese 

Very helpfull shoul be a

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