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November 1997

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 13 Nov 1997 10:08:55 +0200
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Daan

Reliability data of BGA's is not always reliable and difficult to transform
to your needs.

- Be aware that the data you get is from the solderballs at the corners of
the chip in the BGA not from the periphery of the device

- Often not the solderballs but internal connections may cause problems

- I don't believe in the results derived from thermal shock tests

However there is always some reliability data for BGA's presented at the
IEMT in Austin Texas. Have a look in their proceedings.

Best Regards


Guenter

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