Hi Daan,
You wrote:
>Instead of testing reliability of producs with PBGA's by thermal cycling
>and shock & vibration tests, I prefer to rely on publicly available
>test-data. Does anyone know a source for such test data or related
>information ?
Yours is a very reasonable attitude; that is what we tried to tell the
industry when we wrote IPC-SM-785, 'Guidelines for Accelerated Reliability
Testing of Surface Mount Solder Attachments'. However, you can not rely on
other peoples test data, because you do not know in most case how the tests
were done, and whether they pertain to your application. However, test data
from many sources have been used to develop guidelines for the 'Design for
Reliability' of solder joints, including BGAs. You may want to refer to
IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies' or ANSI/IPC J-STD-013, 'Implementation of Ball Grid Array
and Other High Density Technology'.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street                                In December:                                            Jasmine Run
Mendham, NJ  07945                                                                  Ormond Beach, FL  32174  USA
Phone & Fax: 973-543-2747                         Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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