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November 1997

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Subject:
From:
KARLA DUGGAN <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 12 Nov 1997 14:28:05 -0600
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Hi Charles,

A few questions for more info:
1. Do you have any input about the pad sizes? For best
results, the wave-soldered pads need to be larger that what
is needed for normal paste and reflow.
The solder pads are sufficient in size

2. What is your conveyor speed? 3.25 fpm

3. What is your solder pot temperature? 500F

4. What is the the orientation of the long side of the SOT23's
relative to the direction of travel thru the wave? What works
best is if they are parallel to the direction of travel.
They are parallel to the direction of travel

5. What kind of flux are you using and how is it being
applied?
Alpha 857 in a foam fluxer

6. Are the SOT23 parts old? Are they solderable in the first
place?
Appear to be because some leads solder just fine in the
wave solder, can easily be touched up with soldering
iron just very inefficient.

The operator says that the last run of boards ran just
fine.  Need to check board contamination but think it is
fine since other parts solder just fine.  Can't place the
parts on top because is a customer design and they
want them on bottom.



Please respond to [log in to unmask]; Please respond to
[log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Charles Barker/IO-US)
Subject:  [TN] SOT23 problems

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