Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Wed, 12 Nov 1997 20:13:57 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
When it's not only shadowing, it might be a combination of a little bit
of shadowing with a non-optimal solderability ? Or perhaps the soldering
pads are contaminated with glue ? (i.e. a hardly visible film, due to
improper cleaning of a bad-glued board). Good luck !
KARLA DUGGAN wrote:
>
> We are currently having problems soldering SOT23 parts on
> the bottom side of a board. We glue the bottom side surface
> mount components and then run through the reflow oven to
> cure the glue. We then run the boards through the wave
> using both a chip and lambda wave.
>
> All the SMT components solder except the SOT23. The
> SOT23 is randomly soldered. Sometimes 2 leads,
> sometimes 1 lead, sometimes all leads, sometimes no
> leads. The shadowing can be accounted for but not all the
> missing solder is due to shadowing.
>
> Has anyone experienced such problems.
>
> Any help is greatly appreciated,
> Karla Duggan
> APACTS
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################
|
|
|