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November 1997

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Subject:
From:
KARLA DUGGAN <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 12 Nov 1997 10:00:36 -0600
Content-Type:
text/plain
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text/plain (30 lines)
We are currently having problems soldering SOT23 parts on
the bottom side of a board.  We glue the bottom side surface
mount components and then run through the reflow oven to
cure the glue.  We then run the boards through the wave
using both a chip and lambda wave.

All the SMT components solder except the SOT23.  The
SOT23 is randomly soldered.  Sometimes 2 leads,
sometimes 1 lead, sometimes all leads, sometimes no
leads.  The shadowing can be accounted for but not all the
missing solder is due to shadowing.

Has anyone experienced such problems.

Any help is greatly appreciated,
Karla Duggan
APACTS

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