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November 1997

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Subject:
From:
Larry Campbell <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 12 Nov 1997 08:18:56 -0500
Content-Type:
text/plain
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text/plain (92 lines)
Liquid Photoimagible Solder Mask.

>>> "Tovey, Roxanne L" <[log in to unmask]>
11/11/97 06:08pm >>>
Can I ask what is LPI?
Roxanne

> ----------
> From:
[log in to unmask][SMTP:[log in to unmask]]
> Sent:         Tuesday, November 11, 1997 2:41 PM
> To:   [log in to unmask]
> Subject:      [TN] Sealing Vias
>
> Among the ways of sealing vias on LPI solder masked boards
are a)
> filling
> the vias with LPI, and b) tenting the vias with dry film solder
mask.
>
> We are on the brink of converting from dry film to LPI on all our
> PCB's.  I
> would appreciate any comments on the relative
merits/demerits of
> boards
> produced by these two processes.  Our supplier recommends
the dry film
> option.
>
> Our boards are sometimes in relatively harsh environments
and are
> designed
> to operate from -40 C to +70 C.
>
>
> Thanks to those of you who responded to my inquiry on how to
repair
> urethane conformally coated boards which have been
contaminated with
> silicone prior to conformal coating.
>
>
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