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November 1997

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Subject:
BGA Pad to via spacing
From:
"COLLINS, GRAHAM" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 12 Nov 1997 06:50:43 -0500
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Good day TechNet!

My question: what is the minimum space between a BGA pad and via that
would still allow soldermask between the two?

regards,

Graham Collins
Process Engineer,
Litton Systems Limited, Atlantic Division
(902) 873-2000 ext 215

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