TECHNET Archives

November 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet Mail Forum.
Date:
Wed, 12 Nov 1997 00:15:25 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Hi Ronan,
Voids can,temporarily, retard crack propagation in their vicinity. The best
work on this subject was done by Charles Schmidt at SRI. However, the effect
is small enough and too localized to have a measurable efect on cyclic life.
Voids can however reduce the heat transfer function in solder joints placed
for thermal reasons.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street                                In December:                                            Jasmine Run
Mendham, NJ  07945                                                                  Ormond Beach, FL  32174  USA
Phone & Fax: 973-543-2747                         Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2