We are working on the problem of bleed from die adhesive on the plated
     gold and the bare laminate of some chip carriers.  We're making some
     progress, but need some help in both the root cause and how to get
     some parts shipped now.

     We get the impression that some of the adhesion promoters used by the
     copper foil people can cause excessive bleed.  These are materials
     such as silanes & zinc on the rough side of the foil.  Has anyone seen
     this?  How would I dissolve them and/or wash them away?

     Also, we are looking at plasma treatment to reduce the bleed.  This is
     a CF4 & oxygen system.  I expect that a high CF4 & relatively short
     time are good.  Any experience there?



     Matt Byrne
     HADCO-Owego
     607-687-3425 x5255

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