TECHNET Archives

November 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Sealing Vias -Reply
From:
Ron Hayashi <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 11 Nov 1997 15:22:56 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines) 
Often when trying to fill via holes with LPI, the holes do not completely fill.
Using a thermal cure soldermask after the HAL operation (assuming
these are Hot Air Level boards), and then plugging with this mask will
give you the best option.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2