Among the ways of sealing vias on LPI solder masked boards are a)  filling
the vias with LPI, and b) tenting the vias with dry film solder mask.

We are on the brink of converting from dry film to LPI on all our PCB's.  I
would appreciate any comments on the relative merits/demerits of boards
produced by these two processes.  Our supplier recommends the dry film
option.

Our boards are sometimes in relatively harsh environments and are designed
to operate from -40 C to +70 C.


Thanks to those of you who responded to my inquiry on how to repair
urethane conformally coated boards which have been contaminated with
silicone prior to conformal coating.

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