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November 1997

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Subject:
(TN): ASSY: Reliability study for copper vs alooy 42 lead frame
From:
Poh Kong Hui <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 12 Nov 1997 07:02:02 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines) 
Hi again,

Is anybody did any study on the solder reliability comparison between the
coppper lead frame and the alloy42.

I have occasion that some of the TSOP components that assemblied onto the
board, and fail at customer place after about a month. It was tested pass
at our facility.


Could anyone advise..

Thks.


Poh

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