**********CALL FOR PAPERS*********
Participate in the electronic interconnection industry's most important forum dedicated exclusively to flexible circuitry. The IPC National Conference on Flexible Circuits will be held March 18-19, 1998 at the Hyatt San Jose Airport in San Jose, CA.

Papers are sought in all areas including: new product applications; market trends; design strategies for flex; material alternatives; processing innovations; microvia and high density interconnect strategies; assembly on flex; high density packaging for flex; and reliability and test data.

To submit an abstract, please send your name and address information along with a 200-300 word description of you presentation to: [log in to unmask]
or by fax to John Riley at 847/509-9798.

The deadline for abstract submission is December 15, 1997.

All presentations must be non-commercial in nature, focusing on technology rather than a company's product.  A hard copy of visuals and/or a paper for the conference proceedings is a requirement in order to deliver  an oral presentation.

Speakers at the IPC National Conference on Flexible Circuits will receive full conference admission and the proceedings at no charge.

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Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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