I'm looking for information on the following:

1.)  Acceleration factor standards (or rules of thumb) for temp. cycling
mixed technology circuit card assemblies.  (temp range, transition time,
dwell time, certain number of cycles = a week of normal operation for a
certain category of equipment)

2.)  Software that can make reliability estimates based on the parts used,
number of solder connections, etc., for circuit board designs --  Also if
there are firms that will input the data and generate reports.


Any information in these areas, or points in the right direction,  would be
appreciated.

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