Guenter
Your information is very interesting! Actually I am looking into this
process too. Couple questions I have regarding your test
are:
1.What kind of board you ran through in your production run, were they
double-sided boards or single-sided boards?
2.How did you apply the flux to boards? Was it flux paste?
3.What kind of placement machine did you use?
4.What was the thickness of the solid solder on pad?
5.What kind of product this technology used in? Are they very density
boards?
6.For your particular board, what is the price difference between SST
and HASL?

If you can provide me the above informaiton or more detail of your
evaluation, I would really appreciate it!
By the way, can you give me the contact of SIPAD?

Thanks
Fulton Feng
Nortel
Tel: 408-565-2266
E-mail: [log in to unmask]


>----------
>From:  Guenter Grossmann[SMTP:[log in to unmask]]
>Sent:  Monday, November 10, 1997 5:07 AM
>To:    [log in to unmask]
>Subject:       [TN] Re [TN] SOLID SOLDER DEPOSIT TECH.
>
>Hi Tamir
>
>We made production tests as well as reliability tests with Solid Solder
>Technology ( SST ). In our case we worked with SIPAD ( there are others but
>that's the one we had ). The PCB's where prefluxed with a slightly sticky
>NoClean Flux. Placement and soldering down to pitch 0.3mm and 0603 was
>peanuts. Even on a placement machine made for pitch 0.5mm. As a trial we
>tried manual placing of the 0.3mm QFP's. No problem. No bend leads, no
>smearing of solder paste, no shorts, no opens. All in all we made 150 PCB's
>without one defect. Thermal cycling ( -20deg C / 100deg C;2deg C / min;
>dwell time 30min) didn't show any sign of unusual crack growth after 3000
>cycles.
>The boards are more expensive though. But a printing equipment able to
>handle 0.5mm not to say 0.3mm isn't that cheap either and you can't let a
>dummy work on such an expensive printer.
>
>Technically there is no reason not to use SSD. Economically I'm not so
>sure. I think it might pay as well.
>
>Best regards
>
>Guenter
>
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