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November 1997

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Subject:
(TN): ASSY: Good Joint
From:
Poh Kong Hui <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 11 Nov 1997 06:58:59 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Hi Technetters,

Could anyone advise, why a good solder joint, failed under temp. cycle. We
could see there is a pretty good joint, on the 3 sides of the joint (it is
a TSOP component), and is having sufficient solder coverage, exccpt the toe.

Please someone help to advise..

Thanks you..


Poh

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