Legend,
        If you aren't using Nitrogen at this time and you haven't changes pastes,
there should be no reason to start using it now.
        Will the profile change.  The answer to this has two sides.  First, does
the paste manufacturer you are working with want you to use a different
profile for BGAs.  Some do.  You best bet is to contact your paste
manufacturer and ask.  Second, even if the reflow profile requirements
don't change, your oven settings probably will.  This is because most
reflow systems have a hard time getting heat to the balls under the
component.  This is not that big a deal, but it is something to keep in
mind.  Your best bet on this one is to instrument the solder joint that you
think will be the coldest on that component and run a profile through your
system and make any changes that may be needed.

Hope this helps,

John Guy
ACI / EMPF
714 N. Senate Ave.
Indianapolis, IN 46202-3112
voice:  (317) 655-EMPF ext.130
fax:    (317) 655-3699
e-mail:         [log in to unmask]


-----Original Message-----
From:   Legend Zhang [SMTP:[log in to unmask]]
Sent:   Friday, November 07, 1997 10:15 AM
To:     [log in to unmask]
Subject:        [TN] BGA soldering profile

Dear Technetters,

Is Nitrigen enviroment essential to BGA(144 pin) reflow
soldering? Should there be any difference between BGA and
general QFP reflow soldering profile? Any feederback would
be appreciated.

--

Best regards,

******************************************************
|          Legend Zhang (Li Zheng)
|          Morolola Cellular, GCCSD
|          Tel: 847-523-1017(O)
|          Fax: 847-523-8796
|          Pager: 847-576-0295, pin:18585
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