Hi Tamir

We made production tests as well as reliability tests with Solid Solder
Technology ( SST ). In our case we worked with SIPAD ( there are others but
that's the one we had ). The PCB's where prefluxed with a slightly sticky
NoClean Flux. Placement and soldering down to pitch 0.3mm and 0603 was
peanuts. Even on a placement machine made for pitch 0.5mm. As a trial we
tried manual placing of the 0.3mm QFP's. No problem. No bend leads, no
smearing of solder paste, no shorts, no opens. All in all we made 150 PCB's
without one defect. Thermal cycling ( -20deg C / 100deg C;2deg C / min;
dwell time 30min) didn't show any sign of unusual crack growth after 3000
cycles.
The boards are more expensive though. But a printing equipment able to
handle 0.5mm not to say 0.3mm isn't that cheap either and you can't let a
dummy work on such an expensive printer.

Technically there is no reason not to use SSD. Economically I'm not so
sure. I think it might pay as well.

Best regards

Guenter

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