I would like to receive comments on what type of BGA Rework Stations are
OEM and CMs using for their BGA rework processes?  also, if you could
share how your BGA pull-out method is and how well it is controlled in
terms of z-axis force, that would be appreciated... Is there an
advantage to being able to control flow rate in addition to heat and
time, or is that something that just sounds good from a marketing
perspective?

Thanks,

Marcelo

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