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November 1997

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Mon, 10 Nov 1997 08:52:51 -0500
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Resin Starvation is one of my current concerns.
It is not addressed in the bare board specifications
because it is not supposed to be present in
laminate.

However I don't see it specificately addressed in the
laminate specs either.

If it is present in laminate it can result in failures in
the bare boards due to electrochemical migration.
Since the bond between resin and glass is poor, any
liquids that the barrrel of the hole comes in contact with
after the holes are drilled can be deposited within and
along the glass weave.  When the board is powered and
moisture is present - you get electrochemical migration.
This shows up very quickly in areas with narrow spacings
but will occur in larger spaces eventially.

As you can see it is a concern of mine also and it's really
bad when you pick it up in a loaded board

Susan Mansilla
Robisan Laboratory

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