Folks, there is not a specific mail list at the present time dealing just with BGAs and related topics. Any related questions should just be posted to this Forum. Les Hymes chairs Task Group 5-22e "SMT Soldering"; their current focus is the development of a new section for J-STD-001B related to BGAs, and update to IPC-S-816 "SMT Process Guideline and Checklist. Les will certainly appreciate any support for this effort. All comments and questions related to BGAs that are posted on the TechNet are provided to this Task Group. If the information hasn't been included in the draft documents already, the TechNet postings will identify the shortfalls so the TG can address them.

Also, remember that subject line content is important to all users of the TechNet so that individuals reviewing the msg list can quickly pass over/delete those items which don't fit their need.



Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
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847-509-9700 x 393
fax 847-509-9798

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