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November 1997

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Subject:
Re: Fab-Selective Gold
From:
John Gordon <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 6 Nov 1997 11:04:34 -0800
Content-Type:
text/plain
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text/plain (23 lines) 
We're trying to determine a process sequence to accomplish the following
board finish:
-Selective Ni/Au (some are through holes)
-SMOBC
-HAL on non-gold conductors

The main problem would be the masking of the gold areas (with through holes)
prior to HAL.

Thanks for any suggestions-

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