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Reply To: | TechNet Mail Forum. |
Date: | Tue, 25 Nov 1997 21:22:05 -0800 |
Content-Type: | text/plain |
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Robert Welch wrote:
>
> Annie,
>
> Since you said oxidized, I'm afraid the condition you describr is due
> to high lead content in the gold bath. Almost all automatic Ni/Au
> machines drag in a small amount of lead into the gold bath,
> regardless of how well everything is run. Because of this the
> gold bath itself must eventually be either treated for lead or
> replaced. I'm realy not sure if there is a functional impact.
> Robert E. Welch
If your problem really is lead contamination, do a lead treatment, then
tin/lead strip your boards before gold plate, preferably after solder
resist and then HASL.
Roger Hammond
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