Charles,
I have performed trials and produced assemblies with "via in pad" for BGA
devices. I have X Ray prints and cross sections for this also. I'm sorry
that I can't give the details over TechNet, but if you (or anybody else
interested) cares to E mail me then I will return the specifics privately.
Thanks
Eddie
[log in to unmask]
I am researching the possibility of puttings vias in pads for BGA.
Is anybody using "Via in Pad" for BGA ?
What are the implications (pros/cons) of using "Via in Pad" for BGA ?
Is the type of BGA (PBGA/CBGA/TBGA) of importance ?
(I am especially interested in non-microvia applications).
Thanks in advance.
Charles Elliott
NPI Process Engineer
Newbridge Networks
[log in to unmask]
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################