At 06:39 AM 11/19/97 -0500, you wrote:
>In talking with Phil Zarrow (A good SMT consultant) yesterday, he convinced
>me that doing through hole refow was a workable concept.
>
>He said to get enough past to fill the holes you must make your solder
>stencil opening larger then the pad.  He said that there sas no tendancy for
>the past to ball up and that the over printed paste would flow into the hole.
>
>Pete Holden
>Coin Acceptors
>[log in to unmask]
>
Could I get a little more info? For the thru-hole comps I assume you only
paste the side opposite the component, what happens if you have thru hole
parts on both sides? Is it possible to reflow both sides at once? Is there
a diff in using this with IR or Hot Air?

Fred Pescitelli
Phoenix Designs
1285 Turner Rd.
Lilburn, GA 30047

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