Hello Pete,

> In talking with Phil Zarrow (A good SMT consultant) yesterday, he
convinced
> me that doing through hole refow was a workable concept.
> He said to get enough past to fill the holes you must make your solder

If you fill the holes with paste, what happens when you insert the TH
component ?

> stencil opening larger then the pad.  He said that there sas no tendancy
for
> the past to ball up and that the over printed paste would flow into the
hole.

Regards,

Paulo Egon

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