In talking with Phil Zarrow (A good SMT consultant) yesterday, he convinced
me that doing through hole refow was a workable concept.

He said to get enough past to fill the holes you must make your solder
stencil opening larger then the pad.  He said that there sas no tendancy for
the past to ball up and that the over printed paste would flow into the hole.

Pete Holden
Coin Acceptors
[log in to unmask]

##############################################################
IPC Designers Council Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DESIGNERCOUNCIL <your full name>
To unsubscribe:   SIGNOFF DESIGNERCOUNCIL
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################