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Reply To: | TechNet Mail Forum. |
Date: | Wed, 5 Nov 1997 20:53:18 +0000 |
Content-Type: | text/plain |
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Sorry for asking, but why in the world would you want unfused tin/lead
on what I am presuming is a copper conductor. The tin will migrate into
the copper forming a tin-copper intermetallic layer very quickly; the
solderability of such a surface will be very poor. You can plate tin-nickel
or solder over nickel and have much better results, both for solderability
retention and for acting as a "lubricant" in the case of tin-nickel.
Perhaps you could elaborate as to what you are trying to acheive.
Regards,
Fred J.
>>> Aric J Parr <[log in to unmask]> 11/05/97
01:50pm >>>
I am trying to find a specification for plating tin/lead on some
parts. I do not want it fused.
I haven't found an IPC spec for this.
Can anyone help me?
Thanks,
Aric Parr
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