Subject: | |
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Reply To: | TechNet Mail Forum. |
Date: | Tue, 4 Nov 1997 00:04:11 UT |
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Douglas, I may not be the most qualified on this subject but, many customers
have found OA processing (water soluble fluxes/pastes) more successful due to
the improved activity under the component. With OA, nitrogen or inert gas
soldering is less critical.
If no-clean is in use, nitrogen becomes much more relevant but the flux
activity is generally insufficient to guarantee good soldering under BGA's.
Clean v No-clean? Is this why you have a shy audience?
Graham Naisbitt
Concoat Ltd Email: [log in to unmask]
Alasan House, Albany Park Tel: +44 (0)1276 691100
Camberley, Surrey GU15 2PL UK Fax: +44 (0)1276 691227
-----Original Message-----
From: TechNet On Behalf Of Douglas H. Bennett
Sent: Monday, November 03, 1997 4:40 PM
To: [log in to unmask]
Subject: [TN] Responses Needed Please!!Nitrogen use w/ BGA reflow
I sent this message last week and am still waitng on some responses. Can
anyone help please???
Hello All,
I am working with some guys just getting into BGA work. We have some
questions about the need for Nitrogen in the reflow process. Does anyone
have any good examples/data/stories etc about how nitrogen has helped with
a BGA application. In other words we are looking for good reasons to
invest in nitrogen to use on the BGA's.
Thanks in advance....
DHB
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