Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Tue, 11 Nov 1997 15:25:23 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
**********CALL FOR PAPERS*********
Participate in the electronic interconnection industry's most important forum dedicated exclusively to flexible circuitry. The IPC National Conference on Flexible Circuits will be held March 18-19, 1998 at the Hyatt San Jose Airport in San Jose, CA.
Papers are sought in all areas including: new product applications; market trends; design strategies for flex; material alternatives; processing innovations; microvia and high density interconnect strategies; assembly on flex; high density packaging for flex; and reliability and test data.
To submit an abstract, please send your name and address information along with a 200-300 word description of you presentation to: [log in to unmask]
or by fax to John Riley at 847/509-9798.
The deadline for abstract submission is December 15, 1997.
All presentations must be non-commercial in nature, focusing on technology rather than a company's product. A hard copy of visuals and/or a paper for the conference proceedings is a requirement in order to deliver an oral presentation.
Speakers at the IPC National Conference on Flexible Circuits will receive full conference admission and the proceedings at no charge.
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################
|
|
|