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November 1997

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TechNet <[log in to unmask]>
Subject:
Re: Mechanical standoff
From:
Tom Hybiske <[log in to unmask]>
Date:
Tue, 4 Nov 1997 11:01:57 -0600
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"TechNet Mail Forum." <[log in to unmask]>, Tom Hybiske <[log in to unmask]>
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........................................................  Some components we keep off
> the board with a washable solder masking material, but this is not a
> precise or quick method.  Is there such a thing as a preformed standoff
> that will dissolve when the assembly is washed, that would be put on the
> lead before insertion into the board?
>
Contact Bivar at bivar.com or (714)951-8808.  They make a product
called Diss-o-Pads that are just what you're looking for.

Tom Hybiske
General Atronics Corp.

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