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November 1997

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TechNet <[log in to unmask]>
Subject:
filling of test vias which are encroached on topside
From:
Ken Patel <[log in to unmask]>
Date:
Tue, 18 Nov 1997 10:38:40 -0800
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"TechNet Mail Forum." <[log in to unmask]>, Ken Patel <[log in to unmask]>
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text/plain (29 lines) 
I have a million dollar question.

If I plug all non-test vias and encroach soldermask all vias including test
vias on topside then I have a question -  how I am going to fill test vias,
as where encroached by solder mask, during wave operation. Bottomside test
vias are not soldermask encroached. In that case any left over contaminant
can be dangerous.

Please reply ASAP your recommendation as I have to release my fab drawing today.

re,
ken patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
575 Cottonwood Dr.              Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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