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October 1997

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Subject:
From:
Jeff Garland <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 7 Oct 1997 13:06:11 -0400
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Why not immersion Au/Ni after LPIM??

Jeff Garland

Art Shuler wrote:

> Does anyone know of a way to completely eliminate gold slivers on a
> PWB
> which is manufactured using a selective gold process? We realize due
> to
> the etch factor, that there will be a 1.4 mil outgrowth when etching 1
>
> oz. copper cladded material.
>
> Mil-P-55110 recognizes that outgrowth will be present on conductors
> plated with metals other than solder, but our customer cannot tolerate
>
> slivering.  We've tried brushing them off with a brass wire brush, but
>
> this seems to aggravate the problem.
>
> Any input would be greatly appreciated.
>
> Thank you
>
> Art
>
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