Does anyone know of a way to completely eliminate gold slivers on a PWB
which is manufactured using a selective gold process? We realize due to
the etch factor, that there will be a 1.4 mil outgrowth when etching 1
oz. copper cladded material.

Mil-P-55110 recognizes that outgrowth will be present on conductors
plated with metals other than solder, but our customer cannot tolerate
slivering.  We've tried brushing them off with a brass wire brush, but
this seems to aggravate the problem.

Any input would be greatly appreciated.

Thank you

Art

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