TECHNET Archives

October 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Patrick Ducas <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 7 Oct 1997 11:52:56 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines)
I am wondering if you (IPC) would be able to answer the following questions
for me.


1.   Has there been any changes since the issue of IPC-A-610 Revision B
Dec. 1994?
2.  Should solder be considered as a surface nodule? (IPC-A-600E  2.7.1 :
Surface Plating)
3.  Is there any width dimension which can be applied to the critical
contact area, therefore allowing the presence of solder on the outside edges?


Alex Holmes

-------------------------------------------------
Patrick Ducas
Process Quality Engineer 
Matrox Electronic Systems Ltd
E-mail: [log in to unmask]
Tél:(514)969-6000 ext.2971   Fax:(514)685-3415
-------------------------------------------------
        	

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2