We are also plaaning to try out this process for two reason :
First one the one you mentioned.
Second one to utilide reflow for controlling component alignment for
0603 and smaller.
Reflow soldering being benign, it should not be affecting integrity to
large extent. The question comes only once it is followed by wave.I also
like to hear on this.
> ----------
> From:         Jim Mathis[SMTP:[log in to unmask]]
> Sent:         October 6, 1997 4:20 PM
> To:   [log in to unmask]
> Subject:      [TECHNET] SMT soldering
>
> In an effort to decrease defects on a mixed technology assembly with
> simple
> SMT's on the "solder side" and thru-holes on the "comp side", we have
> adopted
> the following process:   We are first gluing, solder-pasting and then
> reflowing the SMT's.  We then flip the board, stuff the thru-holes,
> and
> wave-solder.  This has enabled us to eliminate the "opens" with the
> reflowed
> solder paste on the SMT's and dramatically reduce the "shorts".
> However,
> this process means the SMT's are reflowed and then waved.
>
> The big question:   Are we introducing potential reliability problems?
> Has
> anyone out there also done this with no adverse long-term reliability
> problems?
>
> All feedback is welcome, especially good news!    Thanks, all.
>
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