Wally
Have you ever used the press-fit connectors of not gold plated? And how
is that working in this case?
I would really appreciate it if you can provide me that kind of
information.

Fulton Feng
Sr. Process Engineer
Nortel
[log in to unmask]


>----------
>From:  Wally Doeling (wallyd)[SMTP:[log in to unmask]]
>Sent:  Monday, October 06, 1997 12:44 PM
>To:    [log in to unmask]
>Subject:       Re: [TECHNET] Press Fit and Ni/Au Surface Finish
>
>        On the other hand, we have been using press-fit into Immersion
>gold/Electroless Nickel, with press-fit connectors for 3 years with no
>problems.
>        The press-fit connectors are Nickel/Gold plated and the gold on
>gold provides the lubricant.
>        Most gold plated press-fit connector pins are underplated with
>nickel also.
>        The trick is to control the hole size to give a good press fit,
>without distorting the fiberglass
>in back of the hole.
>        It does work!  And works well.
>        [log in to unmask]
>
>        -----Original Message-----
>        From:   Paul Gould [SMTP:[log in to unmask]]
>        Sent:   Monday, October 06, 1997 10:16 AM
>        To:     [log in to unmask]
>        Subject:        Re: [TECHNET] Press Fit and Ni/Au Surface Finish
>
>        Gus Morvillo wrote:-
>        >I am looking into E Ni/ I Au surface finishes, and have heard
>of a concern
>        >about press fit connectors and barrel cracking. Has anyone
>experienced this
>        >problem?
>        >Would there be a retention force issue, with one removal and
>re-insert?
>        Hi Gus,
>
>        E Ni/I Au is not recommended for press fit for two reasons.
>        Firstly, solder acts as a lubricant to pin insertion and forms a
>gas
>        tight seal which is why it is recommended for press fit.
>        Secondly, Electroless Nickel is brittle and fractures which
>could result
>        in stray metal causing subsequent connector shorts. Also, there
>is no
>        gas tight seal formed which could lead to future corrosion.
>
>        We produce many multi-layer backplane pcb's for global companies
>and
>        they still specify tin-lead, either Reflowed or HASL. I have not
>seen
>        any other alternatives mentioned or been asked to come up with
>one.
>
>        Best Regards
>        Paul Gould
>        [log in to unmask]
>        Teknacron Circuits Ltd
>        Isle of Wight,UK
>
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