In an effort to decrease defects on a mixed technology assembly with simple
SMT's on the "solder side" and thru-holes on the "comp side", we have adopted
the following process:   We are first gluing, solder-pasting and then
reflowing the SMT's.  We then flip the board, stuff the thru-holes, and
wave-solder.  This has enabled us to eliminate the "opens" with the reflowed
solder paste on the SMT's and dramatically reduce the "shorts".  However,
this process means the SMT's are reflowed and then waved.

The big question:   Are we introducing potential reliability problems?  Has
anyone out there also done this with no adverse long-term reliability
problems?

All feedback is welcome, especially good news!    Thanks, all.

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