I am investigating CIC post separation caused by smutting.

What is the mechanism for smutting?
What is the relationship between Invar processing and elevated copper
concentrations in the Conditioner? --Smutting only occurs when the copper
concentration in the conditioner is high (15+ ppm), and the processing of   CIC
boards raises the copper concentration by 10-15 ppm.
Why is a double CIC layer board more susceptible to smutting than a single CIC
layer board?
Does anyone have any suggestions on how to reduce or eliminate smutting?

 Any responses or suggestions would be greatly appreciated.

Robert Childers
Engineering Co-op
Raytheon TI Systems
Austin, TX

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