Graham,
We use the same coating as would be applied to the actual production
PWA. On commercial hardware we use acrylic, on military typically
silicone or polyurethane. We also apply with same method and thickness
used for production.
Jim
> ----------
> From: Graham Naisbitt[SMTP:[log in to unmask]]
> Sent: Saturday, October 04, 1997 7:07 AM
> To: [log in to unmask]
> Subject: Re: [TECHNET] SIR Testing
>
> Jim, et al
>
> I am curious, you use a conformal coating to protect the connection
> terminations and then test.
>
> Question: Which coating do you use and how long do you leave it before
> you do
> the test?
>
> Graham Naisbitt
>
> By the way Jim, your modified connector box and software will be ready
> next
> week!
>
> Concoat Ltd Email:
> [log in to unmask]
> Alasan House, Albany Park Tel: +44 (0)1276
> 691100
> Camberley, Surrey GU15 2PL UK Fax: +44 (0)1276 691227
>
>
> -----Original Message-----
> From: TechNet On Behalf Of Maguire, James F
> Sent: Friday, October 03, 1997 5:17 PM
> To: [log in to unmask]
> Subject: Re: [TECHNET] SIR Testing
>
> We hard wire teflon coated wires to pads. Our preference is to solder
> the
> wires during the test PWA assembly (as opposed to a separate "wiring"
> solder
> operation"; in this case we solder in a short, uninsulated bus wire
> and then
> crimp to test leads after using teflon insulated crimp lugs.
>
> When we do wire after assembly we apply conformal coating (all our
> testing is
> condensing and thus coating used) and then solder with use R flux and
> IPA swap
> (no rinsing, it may spread contaminate).
>
> We have used edge connectors but found problems with leakage,
> contamination,
> and the extra cost of getting gold plated edge contacts and connector
> contacts. (using sn or solder plated contacts we had oxidation which
> caused
> reading to appear good (high) when in fact it was just a current loss
> at
> contact. Also we've seen mixing of gold/solder (e.g. Au contact to
> solder
> plated pad) -> galvanic corrosion which toasts the test.
>
> Jim
>
> Jim.
> ===============================
> Jim Maguire
> Senior Principal Engineer
> Boeing Defense & Space Group
> PO Box 3999 M/S 3W-97
> Seattle, WA 98124-2499
> Phone (206)657-9063 Fax 657-8903
> Email: [log in to unmask]
> ================================
>
> > ----------
> > From: Doug Pauls[SMTP:[log in to unmask]]
> > Reply To: TechNet Mail Forum.;[log in to unmask]
> > Sent: Tuesday, September 23, 1997 8:40 AM
> > To: [log in to unmask]
> > Subject: [TECHNET] SIR Testing
> >
> > Good Morning All,
> >
> > A quick survey, if you don't mind. For those of you who do SIR
> > testing
> > in-house, do you use hard wiring, i.e. soldering individual wires to
> > test
> > points, or do you use edge card connectors, or some other attachment
> > method?
> >
> >
> > I ask the question because this may be one area that the IPC SIR
> task
> > group
> > will examine in the future.
> >
> > Doug Pauls
> > CSL.
> >
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