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October 1997

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Date:
Thu, 30 Oct 1997 11:24:53 -0500
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Hi Ted,
What you describe sure sounds like a fatigue problem stemming from a design
that did not consider the effects of thermal expansion mismatches, global or
local. Appendix A of IPC-D-279 is applicable if what you have is a fatigue
problem (I can not be really sure without seeing more details). You should
however check if the damage terms in the Appendix A analysis fit your
applications and that your application does not violate any of the stated
caveats.
For testing procedures I would refer you to IPC-SM-785.
You could make your life easier and get things done faster by hiring me.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

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